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3D chips: Layered power

Vertical stacking of chips promises faster devices and powerful applications, shattering the limits of traditional semiconductor designs.

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Quantumrun Foresight
August 21, 2024

Insight summary

Three-dimensional integrated circuits (3D ICs) stack chips vertically, improving performance and energy efficiency. This trend addresses the slowing progress of transistor shrinking and the size limits of single chips, enabling advanced applications like artificial intelligence (AI) and virtual reality (VR). Despite the benefits, 3D IC technology also presents challenges, such as thermal management and increased complexity in testing.

3D chips context

3D chips are emerging as a solution to the limitations of traditional semiconductor technology, driven by the need for more powerful and compact electronic devices. By stacking multiple chips vertically, 3D ICs enable shorter and denser interconnections, enhancing performance and reducing energy consumption. This technology addresses the slowdown in transistor shrinking and the physical size limits of individual chips. Advanced packaging technologies like 2.5D and 3D ICs are key to achieving higher performance in modern processors.

Technology companies IBM Research and Tokyo Electron (TEL) have partnered since 2018 to develop a new process for producing 300 mm silicon wafers for 3D chip stacking. A breakthrough in 2022 allowed silicon wafers to be bonded without glass carriers, simplifying the supply chain and reducing defects. Such collaborations are crucial as they enable the integration of multiple chiplets, optimizing each for specific functions and overcoming the limitations of monolithic designs.

Despite its advantages, 3D IC technology presents several challenges, including thermal management and mechanical stress analysis. Stacking chips increases the complexity of managing heat and mechanical stress due to different thermal expansion coefficients. Additionally, testing these complex systems is more challenging than testing traditional single-layer chips. These issues require innovative solutions and careful design considerations.

Disruptive impact

Consumers may experience faster, more energy-efficient smartphones, laptops, and wearable devices due to the improved data transfer speeds and reduced power consumption of 3D ICs. Additionally, the increased processing power will support more advanced applications, such as augmented and virtual reality (AR/VR), and artificial intelligence (AI), making these technologies more accessible and practical in everyday life. However, as devices become more complex, individuals may face higher costs and potential challenges in maintenance and repair.

Businesses may leverage the increased performance and reduced power consumption of 3D ICs to create innovative solutions in AI, high-performance computing, and data centers. This trend may also lead to more efficient manufacturing processes and reduced costs in the long run, as smaller, more powerful chips require less material and space. However, companies may face significant initial investments in research, development, and new manufacturing equipment, as well as the need to address potential challenges in thermal management and reliability.

Governments may invest in research and development initiatives, incentivizing companies to adopt and innovate with 3D ICs and ensuring that regulatory frameworks are in place to address potential security and privacy concerns. They may also need to collaborate on standards and best practices to ensure the interoperability and safety of 3D ICs globally. Additionally, the increased demand for semiconductors may drive governments to focus on securing and diversifying their supply chains to mitigate risks associated with global supply chain disruptions.

Implications of 3D chips

Wider implications of 3D chips may include:

Increased demand for highly skilled workers in semiconductor manufacturing, leading to more specialized job training programs and higher wages in the tech sector.

More efficient and powerful medical devices, improving patient care and enabling advanced treatments for chronic diseases.

Greater energy efficiency in data centers, reducing operational costs and lowering the environmental impact of large-scale computing operations.

Companies shifting their business models to focus on offering more data-intensive services, such as cloud computing and real-time analytics.

Accelerated urbanization in regions with significant semiconductor manufacturing, driving economic growth and demographic shifts.

More widespread use of advanced AI in everyday applications, increasing convenience and productivity for individuals and businesses.

Increased collaboration between international semiconductor companies to standardize 3D IC technologies, fostering global innovation and competition.

Greater scrutiny and regulation of electronic waste disposal practices, promoting environmentally responsible behavior and reducing pollution.

Enhanced national security measures to protect critical semiconductor infrastructure from cyber threats, ensuring the stability and safety of technological advancements.